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Semiconductor-Grade Die Attach Solutions
At the packaging level, the connection quality between chip and frame directly determines the device's electrical performance and long-term lifespan index. Our material solutions optimize interface wetting dynamics and cohesive strength.
Core Empowering Advantages
- ▣ Top thermal efficiency: Ultra-low thermal resistance interface material specifically designed for high-power packaging.
- ▣ Ultimate stress buffering: Flexible alloy technology resisting thermal stress mismatch between chip and substrate.
- ▣ No electromigration hazards: Meets stringent ionic purity requirements for medical and aerospace grades.
Alpha Die Attach Product Matrix
Covering the full range of requirements from standard packaging to high-power applications:
| Product/Technology | Solder Paste | Ag Sinter | High-temp Alloy | LED/Optoelectronics | Power Module | Standard IC |
|---|---|---|---|---|---|---|
| Argomax® Sinter Paste | ✓ | ✓ | ✓ | |||
| GA Series Paste | ✓ | ✓ | ✓ | |||
| BiAgX High-temp Alloy | ✓ | ✓ | ||||
| SnAg Low-temp Paste | ✓ | ✓ | ✓ |
High Performance & Reliability
- Maximum thermal & power cycling life
- Outstanding thermal conductivity
- Supporting thin pkg & 3D stacking
Manufacturing Efficiency
- Dispensing & Printing compatible
- Ultra-low Voiding levels
- Superior high-temp stability