Advanced Process Matrix > PoP Stacked Packaging

Package on Package (PoP)

For high-precision assembly of 3D stacked Package on Package (PoP). Using Alpha's high-performance tacky flux and ultra-fine solder paste. Solving alignment deviation and uneven wetting challenges in micron-level gaps.

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PoP Packaging Process

3D High-Density Integration Solutions

In the vertical stacking of mobile processors and memory chips, material thickness consistency and thermodynamic behavior are the key to manufacturing success. Our solutions are specifically designed to achieve 100% wetting in the narrow package overlap area.

Core Empowering Advantages

  • ▣ Ultimate adhesion stability: Ensuring chip has no displacement or tilt during reflow soldering.
  • ▣ Extremely low residue water-soluble system: Completely eliminating potential electrochemical failure points between stacked layers.
  • ▣ Compatible with ultra-fine pitch: Perfect rheology match for Type 6 and above micro-powder solder paste.

Package on Package Application Products

Solder Paste

Product Lead-Free SnPb Low Temp High Reliability Low Ag Water Soluble
PoP-33 X
PoP-34

Flux

PoP-707

Alpha Stencils

Alpha Cut Alpha Repair
Alpha Nickel-Cut Alpha Squeegee
Alpha Form Alpha Inspect
Alpha Tetrabond Alpha Step
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