Advanced Process Matrix > PoP Stacked Packaging

Precision Interconnects
Space Empowerment

For high-precision assembly of 3D stacked Package on Package (PoP). Using Alpha's high-performance tacky flux and ultra-fine solder paste. Solving alignment deviation and uneven wetting challenges in micron-level gaps.

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PoP Packaging Process

3D High-Density Integration Solutions

In the vertical stacking of mobile processors and memory chips, material thickness consistency and thermodynamic behavior are the key to manufacturing success. Our solutions are specifically designed to achieve 100% wetting in the narrow package overlap area.

Core Empowering Advantages

  • ▣ Ultimate adhesion stability: Ensuring chip has no displacement or tilt during reflow soldering.
  • ▣ Extremely low residue water-soluble system: Completely eliminating potential electrochemical failure points between stacked layers.
  • ▣ Compatible with ultra-fine pitch: Perfect rheology match for Type 6 and above micro-powder solder paste.

Full PoP Packaging Toolset Support

Alpha StepPrecision Step Stencils
Alpha Nickel-CutNickel Cutting Tech
Alpha TetrabondHigh-Precision Frames
Alpha RepairPkg Rework Systems
Alpha InspectInspection Solutions
PoP-707 FluxSpecial Tacky Flux
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