Industry Verticals > Mobile Communication Terminal

Reaching the Micron Limit
Reshaping Terminal Profiles

For 5G terminals, VR/AR wearables, and precision modules. Solving double challenges in spatial limitation and drop resistance with low-temp and fine-pitch tech.

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Mobile Electronics
Alpha Precision Grade Solution

Precisely Empowering Extreme Miniaturization

Mobile terminals are evolving towards thinner and higher computing power. Our advanced materials significantly improve first-pass yield through optimized particle size distribution (Type 5/6/7) and low-temp reflow curves.

Core Technical Advantages

  • ◈ ◈ Low-temp soldering technology: Effectively prevents warping of thin PCBs and FPCs by reducing reflow peak temperatures.
  • ◈ ◈ Excellent drop resistance: Alloy interface designed for shock absorption, extending the terminal lifecycle.
  • ◈ ◈ No-clean flux system: Extremely low residue, meeting extreme cleanliness requirements for high-density packaging.
  • ◈ ◈ Smart wearable adaptation: Providing biocompatible soldering materials, supporting innovation in medical wearables.

Application Process Analysis

For the assembly of 01005 and 008004 components in smartphones, Alpha ultra-fine powder solder paste (Type 6/7) effectively eliminates wicking and solder balling with precise stencil design.

Additionally, our no-clean technology supports extremely high Surface Insulation Resistance (SIR), preventing electromigration failures caused by humidity. We provide full interconnection trust for rapid mass production.

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