Argomax is offered in both sinter paste and sinter film to support high volume die attach processes. The film enables heated dies to be laminated and directly sintered onto DBC substrates, while paste supports dispensing or printing, enabling a +50% increase in switching current.
In the new generation of devices, topside attachment uses sintered clips or sintered copper foils. Laminating and sintering clips or foils to the die topside supports increased reliability and current density, enabling an assembly ready interconnect for a fully sintered solution.
A sintering solution with flat nozzle dispense enables the application of Argomax paste for an entire inverter in <20 seconds. It accommodates warpage and sinters with low pressure, lower temperature, and faster times without cracking the molded package.
High throughput can be realized by lamination of an entire wafer with Argomax film. Precut film is laminated onto wafers up to 12" in diameter. Wafers are then diced and dies are assembled onto the substrate by hot tacking, cold tacking, or direct sintering.
The Junjun Tech engineering team will provide you with targeted sample testing and highly reliable process guidance to help you overcome demanding manufacturing challenges.