Halogen-Free Low-Solids No-Clean

ALPHA® EF-6850HF
No-Clean Wave Soldering Flux

Halogen-Free, Low-Solids, Alcohol-Based, No-Clean Wave Soldering Flux

Product Overview

ALPHA EF-6850HF is a Halogen-Free, low solids, alcohol based, no clean flux for lead-free wave soldering. It is formulated for both standard and thicker, high-density PCBs used in Pb-free applications.

It is designed for low bridging, as well as, to provide superior performance in pin testing, hole-fill and solderballing. Additionally, it provides good cosmetics with a uniform, tack free residue.

ALPHA® EF-6850HF

Key Features & Benefits

Liquid Flux
  • Halogen Free Environmentally friendly. Complies with halogen free industry standards.
  • Unique activator / package Produces highly reliable assemblies with excellent cosmetics and pin testability.
  • Low surface tension High through hole penetration rate and uniform SMT pad coverage.
  • Thermally stable Excellent soldering in both single and dual wave processing using SAC305 or other low silver alloys.
  • Tack free residue Pin testable, uniform, transparent, tack free residue.
View Detailed Technical Specifications

APPLICATION GUIDELINES

PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common specification for the ionic cleanliness of incoming boards and components is 10 µg/in² maximum, as measured by an Omegameter with heated solution.

Care should be taken in handling the circuit boards throughout the process. Boards should always be held at the edges. The use of clean, lint-free gloves is also recommended.

Conveyors, fingers and pallets should be cleaned regularly to reduce the build-up of flux residues. ALPHA AutoClean 40 cleaner is recommended for this process.

FLUX APPLICATION: ALPHA EF-6850HF can be applied by spray, foam or wave application. A uniform coating of flux is essential to successful soldering. When applying flux, it is important to run a series of tests to ensure that the flux is being applied uniformly, that it is penetrating from top to bottom of the board on all holes to be soldered and to make sure that excessive amounts of flux are not being applied.

OPERATING PARAMETERSAC 305 or Low Ag SAC alloys
Amount of Flux AppliedSingle : 1,200 – 1,600 µg/in² solids
Dual : 1,400 – 2,000 µg/in² solids
Top-Side Preheat Temperature90 - 120°C
Bottom side Preheat Temperature110 - 140°C
Recommended Preheat ProfileStraight ramp to desired top-side temperature
Maximum Ramp Rate of Topside Temperature
(to avoid component damage)
2°C/second (35°F/second) maximum
Contact Time in the Solder
(includes Chip Wave and Primary Wave)
3 – 6 seconds
Solder Pot Temperature:255-265°C

FLUX SOLIDS CONTROL & RESIDUE REMOVAL

FLUX SOLIDS CONTROL: If rotary drum spray fluxing, the flux solids will need to be controlled via thinner addition. For measuring the solids content, Alpha's Flux Solids Control Kit #3, a digital titrator, is suggested. Request Alpha's Technical Bulletin SM-458 for details on the kit and titration procedure. When operating a rotary drum fluxer continuously, the acid number should be checked every eight hours. Over time, debris and contaminants will accumulate in recirculating type flux applicators. For consistent soldering performance, dispose of spent flux every 40 hours of operation. After emptying the flux, the reservoir should be thoroughly cleaned with IPA.

RESIDUE REMOVAL: ALPHA EF-6850HF is a no-clean flux and the residues are designed to be left on the board. If desired, flux residues can be removed with Alpha 2110 saponifier cleaner and with other commercially available solvent cleaners and saponifier cleaners.

TECHNICAL SPECIFICATIONS

Physical PropertiesTypical ValuesParameters/Test MethodTypical Values
AppearanceClear, Light AmberpH, 5% v/v aqueous solution2.8
Solids Content, wt/wt4.0%Recommended ThinnerALPHA 425
Specific Gravity @ 25°C (77°F)0.793Shelf Life12 months
Acid Number (mg KOH/g)21.47IPC J-STD-004 DesignationROL0
Flash Point (T.C.C.)17°C

SAFETY

Consult the SDS for all safety information. The most recent version of the SDS is available from alphaassembly.com. Inhalation of the volatilized flux activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture the fumes. Observe precautions during handling and use. Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.

HALOGEN CLASS

StandardRequirementTest MethodStatus
IEC 61249-2-21Post soldering residues contain <900ppm each or total of <1500ppm Br or Cl from flame retardant sourceTM EN 14582 Solids extraction per IPC TM 2.3.34PASS
JEDEC - A Guideline for Defining “Low Halogen” Electronic productsPost soldering residues contain <1000ppm Br or Cl from flame retardant sourcePASS

CORROSION & ELECTRICAL TESTING – SAC305 ALLOY

CORROSION TEST

TestRequirement for ROL0Results
IPCSilver Chromate Paper
IPC-TM 650 Test Method 2.3.33
No detection of halidePASS
Copper Mirror Test
IPC-TM 650 Test Method 2.3.32
No complete removal of copperPASS
Copper Corrosion Test
IPC-TM650 Test Method 2.6.15
No evidence of corrosion N/APASS
JISCopper Corrosion Test
JIS Z3197-1999 Test Method 8.4.1
No evidence of corrosionPASS

IPC J-STD-004B SURFACE INSULATION RESISTANCE

TestRequirements
(<1.0 x 10⁸ allowed during initial 24 hrs.)
Results (min. of all measurements recorded)
< 24 Hrs24 – 168 HrsVisual
"Comb-Down" Un-cleaned> 1.0 x 10⁸ Ω6.8 x 10¹⁰ Ω6.2 x 10¹⁰ ΩPASS
"Comb-Up" Un-cleaned> 1.0 x 10⁸ Ω1.4 x 10¹⁰ Ω2.7 x 10¹⁰ ΩPASS
Control Boards> 1.0 x 10⁹ Ω1.8 x 10¹¹ Ω1.8 x 10¹¹ ΩNA

IPC Test Condition (per J-STD-004B TM2.6.3.7): IPC B-24 coupons, 12V, 40ºC, 90% RH, measurements recorded @ 20min intervals

JIS STANDARD SURFACE INSULATION RESISTANCE

TestConditionsRequirementsControlsResults
InitialAmbient> 1.0 x 10¹¹ Ω9.7 x 10¹¹ Ω9.8 x 10¹¹ Ω
After 7 days40°C / 90% RH> 1.0 x 10¹⁰ Ω1.0 x 10¹² Ω7.5 x 10¹¹ Ω
Recovered25°C/75% RH, 7 days> 1.0 x 10¹¹ Ω1.0 x 10¹² Ω1.0 x 10¹² Ω

All Measurements @ 100V, JIS Boards (0.32mm lines, 0.32 mm spacing, same as IPC B25 Boards).

BELLCORE SURFACE INSULATION RESISTANCE

TestConditionsRequirements¹Results¹
"Comb-Down" Un-cleaned35°C/85% RH, 4 days> 1.0 x 10¹¹ Ω3.6 x 10¹¹ Ω
"Comb-Up" Un-cleaned35°C/85% RH, 4 days> 1.0 x 10¹¹ Ω> 1.0 x 10¹² Ω
Control Boards35°C/85% RH, 4 days> 2.0 x 10¹¹ Ω> 1.0 x 10¹² Ω

Bellcore Test Condition (per GR 78-CORE, Issue 1: 48 Volts, measurement @ 100V/25 mil lines/50 mil spacing.

BELLCORE ELECTROMIGRATION

TestSIR (Initial)¹SIR (Final)¹RequirementResultVisual Result
"Comb-Up"
Un-cleaned
1.0 x 10¹¹ Ω3.5 x 10¹¹ ΩSIR (Initial)/SIR (Final) <100.29PASS
"Comb-Down"
Un-cleaned
2.1 x 10¹⁰ Ω6.5 x 10¹⁰ ΩSIR (Initial)/SIR (Final) <100.32PASS
Control1.0 x 10¹¹ Ω5.9 x 10¹¹ ΩNot applicable0.17PASS

Bellcore Test Condition (per GR 78-CORE, Issue 1): 65°C/85% RH/500 Hours/10V, measurement @ 100V/IPC B-25B Pattern (12.5 mil lines, 12.5 mil spacing).