Zero Halogen Low Voiding ICT Testable

ALPHA® CVP-390
No-Clean Solder Paste

Zero-halogen, low-voiding, fine-feature solder paste with excellent pin-testability, engineered for maximum assembly yields.

Product Overview

ALPHA CVP-390 is a zero-halogen, lead-free, no-clean solder paste designed specifically for applications requiring high ICT (In-Circuit Test) yields. Its unique flux residue physical properties ensure exceptional contact for test probes, effectively reducing false fail rates during testing.

Featuring SACX0307 lead-free alloy, this product is an ideal drop-in replacement for traditional Sn63 alloys across various soldering processes. It enables stable fine-feature printing down to 180μm circles with 100μm thick stencils, with excellent volume repeatability. ALPHA CVP-390 also achieves IPC-7095 Class III voiding performance, providing superior long-term reliability for solder joints.

ALPHA® CVP-390 Solder Paste Product Image

Core Advantages

Excellent Pin-testability ensures high ICT yields
Low voiding performance meeting IPC-7095 Class III
Fine-feature printing supporting 180μm pitch
Zero-halogen formula compliant with JEITA/IEC

Electrochemical Reliability

ALPHA CVP-390 is engineered for exceptional electrochemical performance in harsh operating environments. It not only passes the JIS copper mirror corrosion test but also demonstrates outstanding performance in the most challenging Surface Insulation Resistance (SIR) profiles.

This superior reliability makes it an ideal choice for high-density assemblies and safety-critical electronics, ensuring stable electrical insulation across various operating conditions.

CVP-390 SIR Test Chart
Excellent Surface Insulation Resistance (SIR) Performance

Process Stability & Yield

CVP-390 Fine Feature Detail
Exceptional fine feature printing and reflow coalescence

ALPHA CVP-390 is engineered to help customers achieve maximum assembly yields by reducing process variations and random solder balling. It maintains consistent wetting performance across multiple finishes, including OSP, ENIG, and ImSn.

  • Long tack force life ensuring high pick-and-place yield
  • Extended stencil life, reducing paste waste
  • Visually clear flux residue for clean solder joints
View Detailed Product Parameters

Product Description

ALPHA CVP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications requiring soldering residues with excellent pin-testability and compliance with JIS copper corrosion test standards. This product also enables stable fine-pitch printing capability, allowing for 180 μm circle printing using a 100 μm thick stencil. Its excellent print volume repeatability helps reduce defects caused by printing process variations. Furthermore, ALPHA CVP-390 achieves IPC-7095 Class III voiding performance. Please carefully read the technical data sheet before using this product.

Features & Benefits

  • Long Stencil Life: Maintains stable printing performance without adding new paste for at least 8 hours of continuous printing.
  • Long High Tack Force Life: Ensures high pick-and-place yield and good component self-alignment capability.
  • Broad Reflow Profile Window: Achieves optimal solderability even on complex, high-density assembly boards.
  • Reduced Random Solder Ball Levels: Minimizes rework and increases first-pass yield.
  • Excellent Coalescence and Wetting: Achieves coalescence of 180 μm circle deposits even in high-temperature environments.
  • Excellent Solder Joint and Flux Residue Cosmetics: No charring or burning of residues even after reflow with long, hot soak profiles.
  • Superior Voiding Performance: Meets IPC-7095 Class III voiding category standards.
  • Safe and Environmentally Friendly: Materials are compliant with RoHS and Halogen-Free requirements, as well as TOSCA and EINECS.

Product Information

Alloy: SAC105, SAC305, SAC405, SACX Plus 0307, SACX Plus 0807, Innolot
Powder Size: Type 3, Type 4, Type 4.5, Type 5, Type 6, and Type 7
Packaging: 500g jar; 10cc & 30cc syringe; 6" and 12" cartridge
Lead-Free: Complies with RoHS Directive EU/2015/863

Halogen Status

Standard Requirement Test Method Status
JEITA ET-7304Bromine, Chlorine, Fluorine content below 1000ppmTM EN 14582Pass
IEC 61249-2-21Total concentration below 1500 ppmPass
IPC 4101BTotal concentration below 1500 ppmPass

Technical Data

Category Result Procedure/Notes
Chemical Properties
Flux ClassROL0IPC J-STD-004B
Copper Mirror TestPass, No breakthroughIPC J-STD-004B
Copper Corrosion TestPass, No corrosionIPC J-STD-004B
Electrical Properties
Surface Insulation Resistance (SIR)Pass, ≥10⁸ OhmsIPC J-STD-004B
ElectromigrationPassBellcore GR-78-CORE
Physical Properties
Tack Force Life> 24 hours maintaining >100gfJIS Z 3284
Spreadability80%JIS Z 3197
Stencil Life> 8 Hours@ 23 °C / 50%RH

Process Guidelines

Storage & Handling Printing Parameters Reflow Environment Cleaning Recommendations
Refrigerate at 0-10°C, 6-month shelf life. Thaw for 4 hours before use. Speed: 25-150mm/s
Pressure: 0.21-0.36kg/cm
Release Speed: 1-5mm/s		 Clean, dry air or nitrogen environment recommended. Can remain on the board. If cleaning is required, Vigon series or SM-110E is recommended.

Reflow Profiles

CVP-390 Typical Reflow Profile

Figure 1: ALPHA CVP-390 Typical Reflow Profile (SAC305 & SACX Plus)

Product Documentation

ALPHA® CVP-390 Solder Paste TDS

Simplified Chinese

ALPHA® CVP-390 Solder Paste TDS

English