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Description
ALPHA OL-107E is a stencil printing solder paste for surface mount technology applications.
Features & Benefits
- Consistent printing performance even during 8 hours of continuous use.
- Excellent solder joint cosmetics, bright and shiny.
- Clear, colorless flux residues designed not to spread onto components or boards, providing satisfactory probe testability.
- Delivers highly consistent deposit volumes for 0.4mm pitch QFP even after 1 hour of printer idle time.
- Outstanding solder spread.
- Exceeds JIS and IPC standards for random solder balling control.
Product Information
Application Guidelines
Suitable for standard and fine-pitch printing on stencils down to 0.125mm (5 mil) aperture. ALPHA OL-107E delivers high post-reflow yields while maintaining outstanding solder joint cosmetics.
Technical Data
| Category | Result | Specification/Remarks |
|---|---|---|
| Chemical Properties | ||
| Activity Classification | ROL0 | IPC J-STD-004 |
| Halogen Content | Halogen-free (by titration); Silver chromate pass | MIL-F-14256 |
| Fluoride Spot Test | Pass | MIL-F-14256 |
| Copper Mirror & Corrosion | Pass | JIS Z 3197 |
| Electrical Properties | ||
| SIR (7 days, 85°C/85%RH) | Pass, 4.2 x 10⁸ohms | IPC J-STD-004 (Pass standard > 1 x 10⁸ohm) |
| SIR (96 hours, 35°C/85%RH) | Pass, 1.7 x 10¹³ ohms | Bellcore GR-78-CORE (Pass standard ≥ 1 x 10¹¹ ohm) |
| Physical Properties | ||
| Residue Color | Residue is colorless and transparent | - |
| Tack Force | ≥ 45 gf (24 hours) | JIS Z 3284 |
| Solder Balling | Pass | IPC J-STD-005; JIS Z 3284 |
| Spread Test | 94% (Sn63Pb37) | JIS Z 3197 |
| Stencil Life | 8 hours | @ 50% RH, 23°C (74°F) |
| Hot Slump | Pass, no bridging at 0.2mm pitch | JIS Z 3284 |
Process Guidelines
| Storage & Handling | Stencil Printing | Reflow | Cleaning |
|---|---|---|---|
|
1. Refrigerate at 0-10°C (32-50°F) to maintain stability. Under these conditions, shelf life is 4 months. 2. Warm to room temperature for at least 4 hours prior to use. Paste temperature must be above 20°C (68°F) before opening. Verify with a thermometer that the temperature is 19-23°C (68-73.4°F) before printing. Recommended operating conditions: 23-25°C (73.4-77°F) and 40-60% RH. 3. Do not mix used paste from the stencil back into the jar of unused paste. 4. These parameters are for reference; optimal settings should be determined locally. |
Stencils: ALPHA CUT or ALPHA FORM stencils are recommended at 0.125 mm (5 mil) thickness. Stencil design varies; contact Alpha stencil facility for assistance. Squeegee: Metal (recommended). Pressure: 0.29 - 0.47 kg/cm. Speed: 25 - 200 mm/s (1-8 in/s). Roll Diameter: 1.5 - 2.0 cm; add paste if diameter falls to 1 cm (0.4"). |
Reflow Gas: Clean dry air or nitrogen. Reflow Profile: Refer to the typical reflow profile below for ALPHA OL-107E Sn63Pb37. |
ALPHA OL-107E post-reflow residue is designed to be left on the board. Semi-aqueous cleaners can be used to remove misprints or soft residues if needed. |
Typical Reflow Profile
Figure 1 – Recommended Soak Reflow Profile
| Reflow Parameter | Typical Value |
|---|---|
| Liquidus | 183°C |
| Ramp Rate | 1 - 2 °C/sec |
| Soak Temperature | 130°C - 160°C |
| Soak Time | 60 - 90 sec |
| Peak Temperature | 210°C - 230°C |
| Time Above Liquidus (TAL) | 30 - 75 sec |
Storage
ALPHA OL-107E should be stored immediately upon receipt in a refrigerator at 0-10°C (32-50°F). Prior to opening and use, it must be allowed to warm up to room temperature to prevent condensation of atmospheric moisture. Under these conditions, the shelf life is 4 months.
Safety & Warnings
Operators are advised to read and review the Safety Data Sheets (SDS) before handling the product for health and safety warnings. SDS documents are available with product shipments.