No-Clean Fine-Pitch Printing High Rheological Stability

ALPHA® OL-107E / OL-107F
No-Clean Solder Paste

ALPHA OL-107 series solder pastes feature stable rheology, providing highly repeatable deposit volumes for fine-pitch stencil printing with clear, probe-testable residues.

Product Overview

ALPHA OL-107E / OL-107F is a no-clean solder paste family developed for high-reliability surface mount technology (SMT) applications. Designed specifically for standard and extremely fine-pitch printing (apertures down to 0.125mm / 5 mil), this paste offers extended print life and excellent rheological stability during continuous production.

Post reflow, the OL-107 series yields clear, colorless, and non-spreading residues. This ensures excellent optics for Automatic Optical Inspection (AOI) while allowing outstanding probe penetration for In-Circuit Testing (ICT/pin-testing). It exhibits superior solder spread and effectively prevents random solder balling, easily meeting international JIS and IPC reliability standards.

ALPHA® OL-107E Solder Paste

Core Features & Benefits

Product Features Detail

Stable Print Performance: Maintains consistent print volume and high precision even after 8 hours of continuous operation.

Clear, Non-Spreading Residue: Post-reflow flux residue is colorless and non-conductive, facilitating probe testability.

Excellent Wetting & Spread: High activity provides exceptional wetting properties, yielding bright and reliable solder joints.

Anti-Solder Balling: Outstanding molten control during reflow, exceeding standard JIS and IPC requirements.

Excellent Stencil Response: Provides full volume response on the first board even after stencils sit idle for 1 hour.

View Detailed Product Parameters

Description

ALPHA OL-107E is a stencil printing solder paste for surface mount technology applications.

Features & Benefits

  • Consistent printing performance even during 8 hours of continuous use.
  • Excellent solder joint cosmetics, bright and shiny.
  • Clear, colorless flux residues designed not to spread onto components or boards, providing satisfactory probe testability.
  • Delivers highly consistent deposit volumes for 0.4mm pitch QFP even after 1 hour of printer idle time.
  • Outstanding solder spread.
  • Exceeds JIS and IPC standards for random solder balling control.

Product Information

Alloys: Sn63Pb37, NT4S, Sn62Pb36Ag2 (including SAC305 and other alloys)
Powder Sizes: Type 3 (25-45μm), Type 4 (20-38μm)
Packaging Sizes: 500g jars and 6" cartridges (includes Hisco 125g/500g configurations)
Flux Gel: Flux gel is available in 30cc syringes for rework applications
Note 1: For other alloys, powder sizes, or packaging types, please contact your local Alpha sales office.

Application Guidelines

Suitable for standard and fine-pitch printing on stencils down to 0.125mm (5 mil) aperture. ALPHA OL-107E delivers high post-reflow yields while maintaining outstanding solder joint cosmetics.

Technical Data

Category Result Specification/Remarks
Chemical Properties
Activity ClassificationROL0IPC J-STD-004
Halogen ContentHalogen-free (by titration); Silver chromate passMIL-F-14256
Fluoride Spot TestPassMIL-F-14256
Copper Mirror & CorrosionPassJIS Z 3197
Electrical Properties
SIR (7 days, 85°C/85%RH)Pass, 4.2 x 10⁸ohmsIPC J-STD-004 (Pass standard > 1 x 10⁸ohm)
SIR (96 hours, 35°C/85%RH)Pass, 1.7 x 10¹³ ohmsBellcore GR-78-CORE (Pass standard ≥ 1 x 10¹¹ ohm)
Physical Properties
Residue ColorResidue is colorless and transparent-
Tack Force≥ 45 gf (24 hours)JIS Z 3284
Solder BallingPassIPC J-STD-005; JIS Z 3284
Spread Test94% (Sn63Pb37)JIS Z 3197
Stencil Life8 hours@ 50% RH, 23°C (74°F)
Hot SlumpPass, no bridging at 0.2mm pitchJIS Z 3284

Process Guidelines

Storage & Handling Stencil Printing Reflow Cleaning

1. Refrigerate at 0-10°C (32-50°F) to maintain stability. Under these conditions, shelf life is 4 months.

2. Warm to room temperature for at least 4 hours prior to use. Paste temperature must be above 20°C (68°F) before opening. Verify with a thermometer that the temperature is 19-23°C (68-73.4°F) before printing. Recommended operating conditions: 23-25°C (73.4-77°F) and 40-60% RH.

3. Do not mix used paste from the stencil back into the jar of unused paste.

4. These parameters are for reference; optimal settings should be determined locally.

Stencils: ALPHA CUT or ALPHA FORM stencils are recommended at 0.125 mm (5 mil) thickness. Stencil design varies; contact Alpha stencil facility for assistance.

Squeegee: Metal (recommended).

Pressure: 0.29 - 0.47 kg/cm.

Speed: 25 - 200 mm/s (1-8 in/s).

Roll Diameter: 1.5 - 2.0 cm; add paste if diameter falls to 1 cm (0.4").

Reflow Gas: Clean dry air or nitrogen.

Reflow Profile: Refer to the typical reflow profile below for ALPHA OL-107E Sn63Pb37.

ALPHA OL-107E post-reflow residue is designed to be left on the board. Semi-aqueous cleaners can be used to remove misprints or soft residues if needed.

Typical Reflow Profile

Figure 1 – Recommended Soak Reflow Profile

0 20 40 60 80 100 120 140 160 180 200 220 240 260 0 1 2 3 4 5 Time (min) Temperature (°C) Liquidus: 183°C Ramp Rate: 1-2°C/sec Soak Zone: 130°C - 160°C 60-90 sec TAL: 30-75 sec Peak Temp: 210°C - 230°C
Reflow Parameter Typical Value
Liquidus183°C
Ramp Rate1 - 2 °C/sec
Soak Temperature130°C - 160°C
Soak Time60 - 90 sec
Peak Temperature210°C - 230°C
Time Above Liquidus (TAL)30 - 75 sec

Storage

ALPHA OL-107E should be stored immediately upon receipt in a refrigerator at 0-10°C (32-50°F). Prior to opening and use, it must be allowed to warm up to room temperature to prevent condensation of atmospheric moisture. Under these conditions, the shelf life is 4 months.

Safety & Warnings

Operators are advised to read and review the Safety Data Sheets (SDS) before handling the product for health and safety warnings. SDS documents are available with product shipments.