Silver-Free No-Clean Cost-Effective Outstanding Mechanical Reliability

ALPHA® OM-100 SnCX® 07
No-Clean Lead-Free Solder Paste

A silver-free solder paste solution designed for value optimization and high reliability, delivering performance comparable to SAC alloys while significantly reducing your total cost of ownership.

Product Overview

ALPHA® OM-100 SnCX 07 is a silver-free solder paste designed to provide reliability comparable to tin-silver-copper (SAC) alloys while significantly improving the total cost of ownership (TCO). This solution is ideal for cost-sensitive applications, enhancing your profitability in every electronics assembly.

Compared to SAC305-based solder pastes, ALPHA OM-100 SnCX 07 exhibits an average of 50% higher resistance to mechanical strain. It significantly extends the service life of major home appliances and smart home electronics, performing exceptionally well under environmental challenges such as vibration and drop shock.

This versatile solder paste combines outstanding performance and cost efficiency, maximizing value without compromising on reliability.

ALPHA® OM-100 SnCX 07 Product Image

Core Advantages

Excellent Drop Shock and Vibration Resistance

Excellent Mechanical Performance: Proven to extend characteristic lifetime by 50% compared to SAC305 in major home appliances and smart consumer electronics, providing up to 40% improvement in drop shock and vibration performance.

Total Cost of Ownership (TCO) Optimization: Saves up to 30% in metal costs compared to tin-silver-copper (SAC) based alloys, optimizing overall costs and improving profit margins.

Reliable Thermal Cycling (TCT) Performance: For operating environments below 100 °C, it delivers thermal cycling performance comparable to SAC305, meeting the reliability requirements of most home appliances.

Excellent Processability: Optimized for more challenging process windows, offering stencil life of up to 16 hours.

Performance & Test Animations

Significant Cost Optimization with Guaranteed Thermal Cycling Reliability

While ALPHA OM-100 SnCX 07 delivers significant material cost savings (up to 30% metal cost reduction) to your electronic manufacturing process, it still provides thermal cycling performance (TCT) comparable to SAC305 for smart home products operating below 100 °C, ensuring long-term stability and reliability.

Macdermid-TCO Animation
TCO vs Reliability Comparison Demo
View Detailed Product Parameters

Product Information

Alloy: SnCX 07
Powder Size: Type 4
Packaging: 500g Jars, 6" & 12" Cartridges
Lead-Free: Complies with RoHS Directive EU/2015/863; Annex II of 2011/65/EU

Technical Data

Category Results Procedure/Remarks
Chemical Properties
Flux Classification ROL0 IPC J-STD-004B
Halide Content Halide-free (by titration)
Passes Silver Chromate Test		 IPC J-STD-004B
Halogen Content Pass, Halogen-Zero - No intentionally added halogens EN14582
Copper Mirror Test Pass, low activity, no breakthrough IPC J-STD-004B
Copper Corrosion Test Pass, low activity, no corrosion IPC J-STD-004B
Electrical Properties
Surface Insulation Resistance
(IPC 7 Days, 40 °C/90% RH)		 Pass, 7 Days ≥ 10⁸ Ω IPC J-STD-004B
Surface Insulation Resistance
(IPC 7 Days, 85 °C/85% RH)		 Pass, 7 Days ≥ 10⁸ Ω IPC J-STD-004C
Physical Properties
Color Clear, colorless flux residue -
Tack Force Life Pass, < 1 g/mm² change over 24 hours at 25 ± 2 °C and 50 ± 10% RH IPC J-STD-005
TM-650 2.4.44
Solder Balling Acceptable IPC J-STD-005
Stencil Life 16 hours 50% RH, 25 °C (74 °F)
Cold Slump (25 °C / 50% RH) Pass, no bridging at 0.20 mm gap and above IPC J-STD-005A
Pass, no bridging at 0.20 mm gap and above JIS Z 3284:1994 Annex 7
Hot Slump (150 °C / 10 mins) Pass, no bridging at 0.25 mm gap and above IPC J-STD-005A
Pass, no bridging at 0.30 mm gap and above JIS Z 3284:1994 Annex 8

Halogen Levels

Halogen Standards
Standard Requirement Test Method Status
JEITA ET-7304
Definition of Halogen-Free Soldering Materials		 Br, Cl, F content in soldering material solids < 1000 ppm TM EN 14582 Pass
IEC 61249-2-21 Br or Cl content from flame retardants in post-soldering residue < 900 ppm, or total < 1500 ppm Pass
JEDEC
Guidelines for Defining "Low Halogen" Electronics		 Br or Cl content from flame retardants in post-soldering residue < 1000 ppm Pass
Halogen-Zero: No halogen compounds are intentionally added to this product.

Application Guidelines

The following process parameters serve as a general guide for a typical SMT process window. Due to variations in assembly processes within the electronics manufacturing industry, the optimal settings for each process should be evaluated individually.

Stencil: A thickness of 0.10 mm (4.0 mil) was internally tested during product development. Stencil design is influenced by many process variables. Please contact your local MacDermid Alpha technical support department for recommendations.

Aperture Design: ALPHA OM-100 SnCX 07 solder paste can be printed using various aperture designs. Optimal printing results are obtained with an Area Ratio (AR) ≥ 0.59.

Squeegee: Metal squeegees are recommended, at angles of 60° or 45°.

Speed: Suitable for stencil printing at speeds between 50 mm/s (2.0 in/s) and 150 mm/s (6.0 in/s).

Pressure: Depending on print speed and the seal between the stencil and the substrate, the typical squeegee pressure for a 30 cm (12 in) squeegee length is 0.18 kg/cm (1.0 lbs/in) to 0.29 kg/cm (1.6 lbs/in). Applications requiring higher printing speeds will need higher blade pressures to ensure a clean stencil surface.

Solder Paste Roll Diameter: A diameter between 1.5 cm (0.60 in) and 2.0 cm (0.80 in) is recommended for optimal performance. Add fresh solder paste when the roll diameter reaches 1.0 cm (0.40 in) or less. The maximum roll size varies by squeegee.

Separation Speed: Recommended separation speed is >5.0 mm/s.

DEK ProFlow® compatibility certified.

Storage and Handling: Refrigerate at 0-10 °C (32 - 50 °F) to ensure stability. Under these storage conditions, ALPHA OM-100 SnCX 07 has a shelf life of 6 months. After refrigeration, allow the solder paste container to warm up to room temperature for 4 hours. Prior to use, the solder paste temperature must be ≥19 °C (66 °F). It is recommended to verify the solder paste temperature with a thermometer before loading it onto the printer to ensure it has reached or exceeded 19 °C (66 °F).

Note: Do not mix used solder paste removed from the stencil with unused solder paste in the jar, as this will alter the rheological properties of the unused paste.

Recommended Reflow Profile

ALPHA OM-100 SnCX 07 Typical Reflow Profile Recommendations

Soak Profile:
275 250 225 200 175 150 125 100 25 0 Temp (deg C) 0 1 2 3 4 5 Time (min) 229°C 40°C to 225°C 2min 30sec- 4min 30 sec 120°C to 225°C 1min 25sec - 3min 170°C to 225°C 30sec - 2min High Soak Peak Temp 235 - 245°C TAL 217 - 225°C 45-90sec Cool Down 1-6°C/sec
Straight Ramp Profile:
275 250 225 200 175 150 125 100 25 0 Temp (deg C) 0 1 2 3 4 5 6 7 8 Time (min) 229°C Straight Ramp >0.7°C/sec, <2°C/sec Peak Temp 235-245°C TAL 45-90sec Cool Down -1 to -6°C/sec

These guidelines are recommendations based on best practices. The typical reflow profiles provided were tested in a laboratory and achieved acceptable performance. Users are still required to optimize the profile for their specific board applications to ensure the best results.

Product Documentation

ALPHA® OM-100 SnCX® 07 Solder Paste TDS

Simplified Chinese

ALPHA® OM-100 SnCX® 07 Solder Paste TDS

English

Striking a Balance Flyer

Simplified Chinese

Striking a Balance Flyer

English

ALPHA® OM-100 SnCX® 07 Solder Paste Brochure

Simplified Chinese

ALPHA® OM-100 SnCX® 07 Solder Paste Brochure

English