Lead Free High Yield Excellent Printing

ALPHA® OM-338-PT
Lead Free Solder Paste

Maximizes reflow yield for lead-free processing with excellent print consistency and a wide reflow profile window.

Product Overview

ALPHA OM-338-PT is a high-performance lead-free solder paste featuring the SAC305 alloy composition. Designed to maximize reflow yield, it ensures excellent solderability and wide process margins for lead-free manufacturing environments.

With print speeds of up to 200mm/sec, OM-338-PT enables fast print cycle times and high process capability, consistently delivering excellent solder and flux cosmetics. It fully complies with JESD97, IPC 7095 Class III, J-STD-005, and RoHS standards.

ALPHA® OM-338-PT Lead Free Solder Paste

Core Features

Maximizes reflow yield for lead free processing
Excellent print consistency with high process capability
Print speeds up to 200mm/sec enabling fast cycle times
Wide reflow profile window with good solderability
Excellent solder and flux cosmetics after reflow
Compatible with either nitrogen or air reflow

Product Specifications

SeriesOM-338-PT
Product TypeLead free solder paste
Physical FormPaste
Chemical CompositionSAC305
ContainerJar
Size100g
Standards MetJESD97, IPC 7095 Class III, J-STD-005, RoHS
View Detailed Product Parameters

Description

ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PT's broad process window is designed to minimize transition concerns from tin/lead to lead free solder paste. This paste yields comparable process performance to tin/lead processes*. ALPHA OM-338-PT offers excellent print capability on various board designs, particularly with ultra-fine pitch (11 mil square) repeatable printing and high throughput applications. The formulation of ALPHA OM-338-PT was specifically designed to enhance the in-circuit pin test yield of ALPHA OM-338, without compromising electrical reliability. The outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-PT is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-PT's capability to yield IPC-7095 Class III voiding performance and ROL0 IPC classification ensures maximum long-term product reliability. *Although lead-free alloys look different from tin/lead alloys, the mechanical strength is comparable to or better than tin/lead or tin/lead/silver alloys.

Features & Benefits

  • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence to circular deposits as small as 0.225mm (0.011 in) with 0.100mm (4mil) thick stencils.
  • Excellent print consistency with high process capability index across all board designs.
  • Print speeds of up to 150mm/sec (6 in/sec), enabling a fast print cycle time and a high throughput.
  • Wide reflow profile window with good solderability on various board/component finishes.
  • Excellent solder and flux cosmetics after reflow soldering.
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield.
  • Excellent pin-test yield for single and double reflow.
  • Meets highest IPC-7095 voiding performance classification of Class III.
  • Excellent reliability properties, halide-free material.
  • Compatible with either nitrogen or air reflow.

Product Information

Alloy: SAC305, SAC350, SAC387, SAC405, SACX Plus 0307 & SACX Plus 0807, e1 alloy per JESD97
Powder Size: Type 3, Type 4, and Type 4.5
Residue: Approximately 5% (w/w)
Packaging: 500g jars, 6" & 12" cartridges, DEK Pro-Flow® cassettes, and 10cc & 30cc syringes
Flux Gel: OM-338-PT Flux Gel is available in 10cc and 30cc syringes for rework
Lead-Free: Complies with RoHS Directive EU/2015/863
Note 1: For other alloys, powder sizes and packaging sizes, contact your local Alpha Sales Office.

Application Guidelines

Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1 in/sec) and 150mm/sec (6 in/sec), with stencil thickness of 0.100mm (0.004 in) to 0.150mm (0.006 in). Blade pressures should be 0.18-0.27 kg/cm of blade (1.0-1.5 lbs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The broad reflow process window will provide high soldering yields with good cosmetics and minimized rework.

Halogen Status

ALPHA OM-338-PT is a halogen-free product and passes the standards listed below:

Standard Requirement Test Method Status
JEITA ET-7304Br, Cl, F < 1000ppmTM EN 14582Pass
IEC 61249-2-21Br or Cl < 900ppm or total < 1500ppm in post reflow residue.Pass
JEDECBr or Cl < 1000ppm in post reflow residue.Pass

Technical Data

Category Result Procedure/Notes
Chemical Properties
Activity LevelROL0IPC J-STD-004A
Halide ContentHalide free (by titration)IPC J-STD-004A
Silver Chromate TestPassIPC J-STD-004A
Copper Mirror TestPass (No evidence of corrosion)IPC J-STD-004A
Electrical Properties
SIR (IPC 7 days @ 85掳C/85%RH)Pass, 4.1 x 10鈦?ohmsIPC J-STD-004A
SIR (Bellcore 96 hrs @ 35掳C/85%RH)Pass, 8.4 x 10鹿鹿 ohmsBellcore GR78-CORE
ElectromigrationPass (Initial = 3.8 x 10鈦? Final = 1.9 x 10鈦?ohms)Bellcore GR78-CORE
Physical Properties (Using 88.5% Metal, Type 3 Powder)
ColorClear, Colorless Flux Residue-
Tack vs. HumidityPass, Change < 1g/mm虏 over 24 hrsIPC J-STD-005
Tack vs. TimePass, Change < 10% @ 24 hrsJIS Z3284 Annex 9
Viscosity83.3% metal, M04 (Type 3); 88.5% metal, M16 (Type 4)Malcom Spiral Viscometer
Solder BallAcceptable (SAC305 & SAC405 alloys)IPC J-STD-005
SpreadPassJIS-Z-3197
SlumpPassIPC J-STD-005

Process Guidelines

Storage & Handling Printing Parameters Reflow Environment Cleaning
Refrigerate @ 1-10掳C (32-50掳F). Shelf life 6 months. Thaw to room temp for 4 hrs before use. Operating stencil temp 20掳C - 32掳C. Speed: 25-150mm/s
Pressure: 0.5-0.7kg/inch
Release: 3-10mm/s		 Clean dry air or nitrogen environment. Residue can remain. For cleaning, ALPHA BC-2200 or SM-110E recommended.

Reflow Profiles

Typical Straight Ramp Profile

Figure 1: Typical Straight Ramp Profile for SAC Alloys

Typical Soak Profile

Figure 2: Typical Soak Profile for SAC Alloys

Safety & Warnings

It is recommended that the company/operator read and review the Safety Data Sheet (SDS) for health and safety warnings prior to use.

Product Documentation

ALPHA® OM-338-PT Solder Paste TDS

Simplified Chinese

ALPHA® OM-338-PT Solder Paste TDS

English