Product Overview
ALPHA OM-5100 is a low-residue, no-clean solder paste designed to maximize SMT line yields. The rheologically optimized flux system provides excellent repeatability and eco-friendliness. Its optimized activator system improves joint solderability and reduces solder balling and other defects while ensuring long-term reliability, meeting process, equipment, and material stability.
The wide reflow window allows this tin-lead solder paste to be used in mixed lead-free assembly processes. Testing demonstrates compatibility with both small components (e.g. 0201 Sn-plated passive components) and large BGA spheres (1mm pitch) using SAC305. Even under high reflow profiles sufficient to melt SAC305 BGA spheres, a small amount of solder maintains adequate cohesion.
Features & Benefits
Product Features
Meets Demands of Tin-Lead Soldering
No-clean solder pastes that meet the demands of tin-lead soldering, delivering outstanding reliability and compliance with standard tin-lead manufacturing parameters.
View Detailed Product Parameters
Product Information
Technical Specifications
| Category | Results | Procedures / Remarks |
|---|---|---|
| Chemical Properties | ||
| Activity Level | ROL0 = J-STD Classification | IPC J-STD-004 (Passes copper mirror test (L), Passes copper corrosion test) |
| Halogen Content | Halogen-free | IPC J-STD-004 (Passes silver chromate paper test, titration) |
| Electrical Properties | ||
| SIR (IPC 7 Days @ 85 °C/85% RH) | 2.6 x 10⁹ ohms | Pass, IPC J-STD-004 {Pass = Min 1 x 10⁸ ohm, uncleaned} |
| SIR (Bellcore 96 Hours @ 35 °C/85% RH) | 1.9 x 10¹² ohms | Pass, Bellcore GR78-CORE {Pass = Min 1 x 10¹¹ ohm} |
| Electromigration (Bellcore 500 Hours @ 65 °C/85% RH) | Pass | Bellcore GR78-CORE 62Sn/36Pb/2Ag {Pass = final > initial/10} |
| Physical Properties | ||
| Flux Residue Appearance | Colorless, transparent flux residue | 63Sn/37Pb alloy |
| Tack Force vs Humidity (24 Hours) | Less than 1g/mm² | IPC J-STD-005 (at 25%, 50%, and 75% relative humidity) |
| Solder Balling | Pass < 10 balls | Passes IPC J-STD-005 (62Sn/36Pb/2Ag, 63Sn/37Pb alloys) |
| Stencil Life | > 8 Hours | @ 50%RH, 23 °C (74 °F) |
| Slump | Pass | IPC J-STD-005 (Hot and cold slump) DIN Standard 32 513, 5.3 |
Process Guidelines
| Storage & Handling | Printing | Reflow | Cleaning |
|---|---|---|---|
|
Stencil: Recommend ALPHA CUT or ALPHA FORM stencils, thickness 0.1 mm (4 mil) to 0.15 mm (6 mil). Pitch 0.4-0.5 mm (0.016-0.020 inch). Squeegee: Metal Pressure: 0.15 to 0.3 kg per cm (0.8-1.5 lbs. per linear inch). Print Speed: 25 mm to 150 mm/sec (1 to 6 inch/sec). Roll Diameter: 1.5 - 2.0 cm (0.6-0.8 inch). Add fresh paste when it falls to 1 cm (0.4 inch). Enclosed Head: ALPHA OM-5100 is compatible with MPM RheoPump and DEK ProFlow. |
Environment: Dry clean air or nitrogen.
Profile: Straight ramp profile recommended. Ramp rate 0.8°C to 1.2°C/sec, TAL 30 to 90 sec, peak temp 210 to 220°C.
High-density boards may require a soak profile:
− Ramp at 1-2 °C/sec to 140-160 °C
− Soak at 140-160 °C for 0-1.0 min
− Ramp at 1-2 °C/sec to peak 210-220 °C
− TAL above liquidus = 30-90 sec
− Cool to room temp at 60-150 °C/min
|
ALPHA OM-5100 post-reflow residues can be left on the board. Misprints and uncured residues can be cleaned with ALPHA SM-110 & SM-110E, or Hydrex™ SP water-based cleaners. |
Recommended Reflow Profiles
Figure 2: Typical SAC Reflow Profile for ALPHA OM-5100
Soak: 175 ºC, 60sec soak, peak 240ºC, TAL 60sec
Reflow Analysis of Mixed SAC305/OM-5100 Sn63 Joints for BGA
With the increasing difficulty in sourcing tin-lead paste, mixed solder joints are becoming common. ALPHA OM-5100's unique chemistry allows users to process Sn63 paste using typical lead-free profiles with lead-free components.
Figure 3 – ALPHA OM-5100 Reflow on BGA SAC305 Spheres
These cross-sections show uniform, continuous IMC layers at the interface between eutectic paste and SAC spheres.
SAC alloy and Sn63 form a continuous joint.
Figure 4 – ALPHA OM-5100 Reflow on Tin-Plated 0201 Chip Components
Cross-section shows uniform, continuous IMC layer formation at the interface.
Storage
ALPHA OM-5100 should be stored in a refrigerator at 0-10°C (32–50°F). Thaw to room temperature before opening and using to prevent condensation.
Safety & Warnings
Operators are advised to read and review the Safety Data Sheets (SDS) for health and safety warnings before use.