Ultra-Fine Dispensing Pin Transfer / Stamping Lead-Free No-Clean Type 6 Solder Powder

ALPHA® LUMET P23
No-Clean Solder Paste

An industry-standard, lead-free, no-clean solder paste designed specifically for ultra-fine-pitch dispensing and pin transfer processes, ideal for LED flip-chip die attach and Micro-LED assembly.

Product Overview

ALPHA® LUMET P23 is an industry-standard, lead-free, no-clean solder paste designed specifically for ultra-fine-pitch dispensing and pin transfer (stamping) applications, such as connecting LED flip chips via pin transfer.

This solder paste is typically formulated with Type 6 solder powder to support ultra-fine feature applications, and is available in standard industrial lead-free alloys including SAC305 and SnCu0.7 (99.3Sn/0.7Cu). It provides excellent coalescence performance and outstanding voiding control (typically 5 - 10%), ensuring high-reliability joint connections.

The ALPHA Lumet P23 flux system features an extended work life. It has been proven in production to offer highly repeatable solder transfer volumes over hours of continuous pin transfer (stamping) operations. It can also be pneumatically dispensed using auger valves to achieve dot sizes down to ~150 μm.

ALPHA® LUMET P23 Solder Paste Product Image

Features & Specifications

LED Flip Chip Die Attach Process

Primary Use: Ideal for precision operations like LED flip-chip die attach and micro-LED assembly.

Particle Size: Typically formulated with Type 6 solder powder to support ultra-fine feature applications.

Alloy Options: Available in standard lead-free alloys including SAC305 and SnCu0.7 (99.3Sn/0.7Cu).

Application Method: Engineered for pin transfer (stamping) and pneumatic dispensing.

Residue: No-clean formulation, meaning the flux residue left after soldering is chemically non-conductive and non-corrosive.

View Detailed Product Parameters

Product Information

Alloy: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SnCu0.7 (99.3%Sn/0.7%Cu)
Powder Size: Type 6
Packaging: 30cc Cartridges (EFD, 100g), 10cc Cartridges (Iwashita, 30g)
Lead-Free: Complies with RoHS Directive EU/2015/863

Halogen Levels

Standard Requirement Test Method Status
JEITA ET-7304
Definition of Halogen-Free Soldering Materials		 Br, Cl, F content in soldering material solids < 1000 ppm TM EN 14582 Pass
IEC 612249-2-21 Br or Cl in post-reflow residue from flame retardants < 900 ppm or total < 1500 ppm Pass
JEDEC
Guidelines defining "Low Halogen" electronics		 Br or Cl in post-reflow residue from flame retardants < 1000 ppm Pass
Zero-Halogen: No halogen compounds are intentionally added to this product.

Technical Specifications

ALPHA LUMET P23
Category Results Procedure/Remarks
Chemical Properties
Flux Activity Level ROL0 IPC J-STD-004A
Halide Content Halide-free (by titration) IPC J-STD-004A
Fluoride Spot Test Pass JIS Z 3197:1999 8.1.4.2.4
Silver Chromate Test Pass IPC J-STD-004A / JIS Z 3197:1999 8.1.4.2.3
Copper Mirror Test Pass IPC J-STD-004A / JIS Z 3197:1999 8.4.2
Copper Corrosion Test Pass (No evidence of corrosion) IPC J-STD-004A / JIS Z 3197:1999 8.4.1
Electrical Properties
Surface Insulation Resistance (IPC 7 Days, 85 °C/85% RH) Pass IPC J-STD-004 (Pass ≥ 1 x 10⁸ ohm)
JIS Electromigration (1000 hours, 85 °C/85% RH, 48V) Pass; no migration after 1000 hours JIS Z 3197:1999 8.5.4
Physical Properties (using SAC305)
Color Clear, colorless flux residue -
Tack Force vs. Time Pass; > 100 gf within 24 hours at 25 °C / 50% RH JIS Z 3284, Annex 9
Solder Balling Preferred; tested after 4 hours storage at 25 °C, 50% RH IPC TM-650 2.4.43
Solder Balling Pass, Category 2; tested after 4 hours storage at 25 °C, 25%, 50%, 75% RH JIS Z 3284, Annex 11
Hot Slump Pass; 0.3 mm gap JIS Z 3284:1994 Annex 8

Application Guidelines

ALPHA LUMET P23 is designed for pin transfer (stamping) on ASM AD830 and similar equipment.

The solder paste thickness on the rotating disk (also known as reservoir thickness) and the pin shape/diameter depend on device size, pad size, and the required bond line thickness (BLT). Typical reservoir thicknesses used in flip-chip applications range between 400 and 700 μm.

Reflow Profiles

Lumet P23 SAC305 T6 Recommended Reflow Profile

300 250 200 150 100 50 0 Temperature [°C] 0 50 100 150 200 250 300 350 400 Time [seconds] 240°C 170°C 130°C 40-50s 60-70s 100-110s Peak 240°C Time Above Liquidus (TAL) 50-60s
Zone L1 L2 L3 L4 L5
Type Ramp-up Soak Ramp-up Reflow Cooling
Temp [°C] 50 - 130 130 - 170 170 - 220 217~ -
Time / Rate 40 - 50s 60 - 70s 100 - 110s 50 - 60s < 4 °C/s

Lumet P23 SnCu0.7 T6 Recommended Reflow Profile

250~260 230 190 150 L1 L2 L3 L4 L5 Time (sec)
Zone L1 L2 L3 L4 L5
Type Ramp-up Soak Ramp-up Reflow Cooling
Temp [°C] 40 - 150 150 - 190 190 - 230 230~ -
Time / Rate 0.8 - 2 °C/s 60 - 120s 30 - 60s 30 - 90s < 4 °C/s

Safety & Warning

It is recommended that your company and production line operators read and review the health and safety warning sections in the Safety Data Sheet (SDS) before using the product. The relevant Safety Data Sheet is available upon request.

Product Documentation

ALPHA® LUMET P23 Solder Paste TDS

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