SAC Series Wave Soldering Lead-Free High Silver

ALPHA® VACULOY®
Solid Solder

High Silver Alloy for Wave and Selective Soldering. Suitable for use as a replacement for Sn63Pb37 alloy.

Product Overview

ALPHA SAC305, SAC387 and SAC405 and their replenishment alloys ALPHA SAC300, SAC350, SAC380 and SAC400 are lead-free alloys suitable for use as a replacement for Sn63Pb37 alloy.

The replenishment alloys are sometimes used to stabilize and reduce the copper content in the wave solder bath, although, this requirement will depend on process conditions.

As with all Alpha’s bar solder, the proprietary Vaculoy alloying process is used to remove certain impurities, particularly oxides.

ALPHA® VACULOY® SAC Series

Features and Benefits

Features and Benefits
Yield: Best in class yield, outperforms all Sn/Cu based materials
Wetting speed: Fast wetting, in back to back tests 0.65s compared to 1.00s for Sn/Cu based materials
Dross generation: Low dross generation delivered by our proprietary Vaculoy manufacturing process
Excellent solderability due to fast wetting speed
Very good drainage, lower levels of bridging compared to Sn/Cu alloys
Delivers excellent performance across a wide range of flux technologies.
View Detailed Product Parameters

Alloy Specifications (Sn, Ag, Cu Content)

Element Specification % SAC305 SAC387 SAC405 SAC300 SAC350 SAC380 SAC400
SnBalanceBalanceBalanceBalanceBalanceBalanceBalance
Ag3.0 ± 0.23.8 ± 0.24.0 ± 0.23.0 ± 0.23.5 ± 0.23.8 ± 0.24.0 ± 0.2
Cu0.5 ± 0.10.7 ± 0.10.5 ± 0.10.05 max0.05 max0.05 max0.05 max

* Note: 0.10% of Lead (Pb) complies with all requirements of RoHS Directive 2015/863/EU. Alloy specification for maximum Lead (Pb) Content = 0.07%. ALPHA SAC alloy is also available in ALPHA Ultra Low Lead (ULL) version which contains a maximum of 0.05% Pb. All figures are in % for impurity limits per alloy in relation to J-STD-006C.

Material Properties

Property SAC305 SAC387 SAC405
Melting Point217 to 219 ºC (423 to 426 ºF)217 to 219 ºC (423 to 426 ºF)217 to 219 ºC (423 to 426 ºF)
Density7.37 g/cm³7.44 g/cm³7.44 g/cm³
TCE (Range 20 to 100 ºC) micrometers / M / ºC21.921.421.4
Specific Heat Capacity0.232 J/g K0.236 J/g K0.236 J/g K
Hardness14.1 HV14.9 HV14.9 HV

Recommended Wave Solder Process Settings

Wave Configuration Process Parameter Suggested Process Settings
Single Wave
Pot Temperature255 to 265 ºC (491 to 509 °F)
Conveyor Speed1.0 to 1.5 m/min (3.3 to 5 ft/min)
Contact Time2.3 to 2.8 seconds
Wave Height1/2 to 2/3 of board thickness
Dross RemovalOnce per 8 hour run time
Copper CheckEvery 8,000 boards until 40,000
Dual Wave
Pot Temperature255 to 265 ºC (491 to 509 °F)
Conveyor Speed1.0 to 1.5 m/min (3.3 to 5 ft/min)
Contact Time3.0 to 3.5 seconds
Wave Height1/2 to 2/3 of board thickness
Dross RemovalOnce per 8 hour run time

Management of Copper Levels in the Solder Bath

Management of the copper level in the wave solder bath is critical to ensure low defects in the soldering process. There is a tendency for the copper levels of the ALPHA SAC305/387/405 materials to increase due to the leaching effect of the solder wave on the board and components. This effect is at its most severe when using an OSP Copper finish on the PCB. A typical copper level increase is shown on the chart below:

Copper leaching on OSP Copper boards