No-Clean Cored Solder Wire Fast Wetting

ALPHA® Telecore Plus
No-Clean Solder Wire

Designed for no-clean soldering applications that require high Surface Insulation Resistance (SIR) reliability and excellent spread characteristics.

Product Description

ALPHA® Telecore Plus is a low residue flux cored solder wire designed for no-clean soldering applications that require high Surface Insulation Resistance (SIR) reliability and excellent spread characteristics.

The unique blend of rosin and proprietary activators provides rapid wetting while leaving minimal, optically clear, and completely inert residues. It is fully engineered to meet stringent industry standards including Bellcore TR-NWT-000078 specifications.

ALPHA® Telecore Plus Product Image

Features & Benefits

Fast Wetting: Delivers exceptionally rapid wetting speeds, making it excellent for high-throughput manual and robotic soldering operations.

Good Spread Characteristics: Offers outstanding solder spread, resulting in the excellent formation of reliable solder joints.

Low, Clear Residue: Leaves minimal, optically clear, non-tacky residues after soldering, eliminating the need for post-solder cleaning.

High Reliability Exhibit: The post-soldering residue is completely inert. It passes Copper Mirror, Copper Corrosion, and rigorous electromigration tests, ensuring superior long-term SIR reliability.

Versatile Metal Compatibility: The powerful activator system is highly effective in soldering to a wide range of mildly oxidized metallic surfaces, including Copper, Gold, Silver, Tin, and Solder coatings.

Standard IPC Classification: Classified as ROL0 per IPC J-STD-004, indicating a highly safe, low-activity rosin-based core flux.

View Detailed Parameters

Product Information

Standard Alloy Designation Melting or Solidus / Liquidus Temp °C Flux Amount
Proprietary SACX Plus® 0307 217 - 228 2.2% & 3.3%
J-STD-006B Sn96.5Ag3.0Cu0.5 (SAC305) 217 - 221 2.2%, 3.3%
J-STD-006B Sn96.5Ag3.5 221 2.2%, 3.3%
J-STD-006B Sn99.3Cu0.7 227 2.2%, 3.3%
J-STD-006B Sn63Pb37 183 1.1%, 2.2%
J-STD-006B Sn62Pb36Ag2 179 1.1%, 2.2%

* TELECORE PLUS may also be available in other or special alloys and flux amounts on request.

Application

A soldered joint is formed by heating the parts to be soldered to a temperature in excess of the melting point of the alloy to be used – in hand soldering this is how a soldering iron is used. By feeding the cored wire onto the parts, the flux is able to flow and remove oxidized metal, while the solder creates a thin inter-metallic bond which becomes the solder joint.

Note the following tips:

  • Use a soldering iron tip size and form to suit the operation: small tips for soldering large components may prevent the formation of a joint or slow the process down.
  • Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered.
  • Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above.
  • A typical solder tip temperature would be between 120°C and 160°C above the liquidus temperature of the alloy. The ideal temperature to use is dependant on how thermally demanding the assembly is.
  • Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right grade for the application.
  • Do not overheat as this causes an increase in the depth of the inter-metallic layer, which in turn weakens the joint.

If you choose to use a liquid rework flux, ALPHA NR205 Flux is recommended to provide the optimal combination of high long-term reliability and low residue level. NR205 Flux is available in Alpha's Write Flux Pens for precision flux application.

Technical Data

Physical Properties

Physical Properties Typical Values
Rosin Grade: WW per Fed Spec. LL-R-626
Rosin Softening Point: 71ºC (160°F)
Halide Content: Passes Silver Chromate Paper Test
Classification: ROL0 per IPC J-STD-004
ISO 12224 – 1.1.2

Electrical Reliability Test

Test Requirements Results
Surface Insulation
Bellcore Test (GR-78-CORE)		 1.0 × 10¹¹ Ω minimum PASS
Electromigration
Bellcore Test (GR-78-CORE)		 SIR(initial)/SIR (Final) < 10 PASS
Water Extract Resistivity
(QQ-S-571F)		 40,000 ohm-cm, typical

Chemical Reliability Test

Test Requirements Results
Copper Mirror Test
(IPC-TM-650- 2.3.32)		 No complete removal of copper PASS
Copper Corrosion Test
(IPC-TM-650-2.6.15)		 No evidence of corrosion PASS

Safety & Storage

Safety

Observe standard precautions for handling and use. Use in well ventilated areas. DO NOT SMOKE during use.

ALPHA TELECORE PLUS cored solder wire is not considered toxic. However, its use in typical soldering applications will generate a small amount of decomposition and fumes. These fumes should be adequately exhausted / vented for operator safety and comfort.

Storage

ALPHA Cored Solder Wires should be stored in dry conditions and within a temperature range of 10°C to 40°C. When stored under these conditions the product shelf life is indefinite. However, Alpha guarantees the product shelf life for three years from the date of manufacture when stored in dry conditions and within 10°C to 40°C.

Product Documentation

ALPHA® Telecore Plus Solder Wire TDS

Simplified Chinese

ALPHA® Telecore Plus Solder Wire TDS

English