View Detailed Product Specifications
Product Description
ALPHA RMA-390-DH6 is a rosin-based paste flux designed for surface mount and other demanding electronic assembly applications. Because of its unique activator package and other special additives, ALPHA RMA-390-DH6 is suitable to remain on the circuit board without cleaning. ALPHA RMA-390-DH6鈥檚 activator system also enables the flux to penetrate even moderately tarnished surfaces. Read the entire technical data sheet before using this product.
Features and Benefits
- Wide Reflow Profile Window: allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 300 掳C.
- Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering even using long/high thermal soaking without charring or burning.
Product Information & Application Guidelines
Application Guidelines:
ALPHA RMA-390-DH6 Paste Flux may be applied by screen printing or pin transfer (substrate) or doctor blade / dip coating (package). It can also be dispensed. ALPHA RMA-390-DH6 can be safely left on the circuit board after reflow without cleaning. If cleaning is desired, most commercially available electronic assembly cleaning solvents are effective. Flux residues are also removable by saponification with ALPHA 2110 in water.
Storage:
ALPHA RMA-390-DH6 is shipped in thermally controlled boxes and should be stored room temperature upon receipt at 66 to 77 掳F (19 to 25 掳C). This will be sufficient to maintain a nominal shelf life of twelve months. ALPHA RMA-390-DH6 should be permitted to reach room temperature before unsealing its package prior to use.
Safety & Warning:
It is recommended that the company/operator read and review the Safety Data Sheets for the appropriate health and safety warnings before use. Safety Data Sheets are available at MacdermidAlpha.com/assembly-solutions/knowledge-base.
Technical Data
| Category | Results | Procedure/Remarks |
|---|---|---|
| Chemical Properties | ||
| Activity Level | ROL0 | IPC J-STD-004 |
| Cu Mirror Corrosion Test | Pass | IPC J-STD-004 |
| Halide Content | Halide - Free | Based on Formulation |
| Electrical Properties | ||
| SIR (Bellcore 96 hours @ 35 掳C / 85%RH) | Pass, 2.5 x 1011 ohms | Bellcore GR78-CORE |
| Electromigration (Bellcore 500 hours @ 65 掳C / 85%RH 10V) | Pass, 2.2 x 1010 ohms | Bellcore GR78-CORE |
| IPC SIR (7 days @ 85 掳 C /85% RH) | Pass, 1.1 x 109 ohms | IPC J-STD-004A |
| HP Electrochemical Migration (28 days @ 50 掳C/90%RH 10V) | Pass | HP ECM |
| Physical Properties | ||
| Color | Smooth, Amber Paste | - |
| Viscosity (5rpm at 25 掳C by Malcom Viscometer) | 110 to 400 Poise (Typical) | - |
| Fineness of Grind (碌m) | <10 碌m | - |
Reflow Profiles
Figure 1: Typical 63Sn37Pb Reflow Profile
Figure 2: Typical SAC Reflow Profile